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E2G0025-17-42 Semiconductor
Semiconductor MSM514900C/CSL
DESCRIPTION
This MSM514900C/CSL version: Jan. 1998 Previous version: May 1997
524,288-Word 9-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
The MSM514900C/CSL is a 524,288-word 9-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM514900C/CSL achieves high integration, high-speed operation, and low-power consumption because Oki manufactures the device in a quadruple-layer polysilicon/ single-layer metal CMOS process. The MSM514900C/CSL is available in a 28-pin plastic SOJ or 28pin plastic TSOP. The MSM514900CSL (the self-refresh version) is specially designed for lowerpower applications.
FEATURES
* 524,288-word 9-bit configuration * Single 5 V power supply, 10% tolerance * Input : TTL compatible, low input capacitance * Output : TTL compatible, 3-state * Refresh : 1024 cycles/16 ms, 1024 cycles/128 ms (SL version) * Fast page mode, read modify write capability * CAS before RAS refresh, hidden refresh, RAS-only refresh capability * CAS before RAS self-refresh capability (SL version) * Package options: 28-pin 400 mil plastic SOJ (SOJ28-P-400-1.27) (Product : MSM514900C/CSL-xxJS) 28-pin 400 mil plastic TSOP (TSOPII28-P-400-1.27-K) (Product : MSM514900C/CSL-xxTS-K) xx indicates speed rank.
PRODUCT FAMILY
Family MSM514900C/CSL-60 MSM514900C/CSL-70 MSM514900C/CSL-80 Access Time (Max.) tRAC tAA tCAC tOEA 60 ns 35 ns 20 ns 20 ns 70 ns 35 ns 20 ns 20 ns 80 ns 40 ns 20 ns 20 ns Power Dissipation Cycle Time (Min.) Operating (Max.) Standby (Max.) 110 ns 130 ns 150 ns 770 mW 715 mW 660 mW 5.5 mW/ 1.1 mW (SL version)
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Semiconductor
MSM514900C/CSL
PIN CONFIGURATION (TOP VIEW)
VCC 1
28 VSS
VCC 1
28 VSS 27 DQ9 26 DQ8 25 DQ7 24 DQ6 23 CAS 22 OE 21 NC 20 A8 19 A7 18 A6 17 A5 16 A4 15 VSS
DQ1 2
27 DQ9
DQ1 2 DQ2 3 DQ3 4 DQ4 5
DQ2 3 DQ3 4 DQ4 5 DQ5 6 WE 7
26 DQ8 25 DQ7 24 DQ6 23 CAS 22 OE
DQ5 6 WE 7
RAS 8 A9R 9
21 NC
RAS 8 A9R 9
20 A8 19 A7 18 A6 17 A5 16 A4
A0 10 A1 11 A2 12 A3 13
A0 10 A1 11 A2 12 A3 13
VCC 14 28-Pin Plastic SOJ
15 VSS
VCC 14 28-Pin Plastic TSOP (K Type)
Pin Name A0 - A8, A9R RAS CAS DQ1 - DQ9 OE WE VCC VSS NC
Function Address Input Row Address Strobe Column Address Strobe Data Input / Data Output Output Enable Write Enable Power Supply (5 V) Ground (0 V) No Connection
Note: The same power supply voltage must be provided to every VCC pin, and the same GND voltage level must be provided to every VSS pin.
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Semiconductor
MSM514900C/CSL
BLOCK DIAGRAM
RAS CAS Timing Generator Timing Generator
9
Column Address Buffers Internal Address Counter
9
Column Decoders
Write Clock Generator
WE OE
9
Output Buffers
9 9
A0 - A8
Refresh Control Clock
Sense Amplifiers
9
I/O Selector
9 9
DQ1 - DQ9
Input Buffers
9
9
A9R VCC
1
Row Address Buffers
10
Row Decoders
Word Drivers
Memory Cells
On Chip VBB Generator VSS
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Semiconductor
MSM514900C/CSL
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter Voltage on Any Pin Relative to VSS Short Circuit Output Current Power Dissipation Operating Temperature Storage Temperature Symbol VT IOS PD* Topr Tstg Rating -1.0 to 7.0 50 1 0 to 70 -55 to 150 Unit V mA W C C
*: Ta = 25C Recommended Operating Conditions
Parameter Power Supply Voltage Input High Voltage Input Low Voltage Symbol VCC VSS VIH VIL Min. 4.5 0 2.4 -1.0 Typ. 5.0 0 -- -- Max. 5.5 0 6.5 0.8 (Ta = 0C to 70C) Unit V V V V
Capacitance
Parameter Input Capacitance (A0 - A8, A9R) Input Capacitance (RAS, CAS, WE, OE) Output Capacitance (DQ1 - DQ9) Symbol CIN1 CIN2 CI/O Typ. -- -- --
(VCC = 5 V 10%, Ta = 25C, f = 1 MHz) Max. 7 7 8 Unit pF pF pF
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Semiconductor DC Characteristics
MSM514900C/CSL
(VCC = 5 V 10%, Ta = 0C to 70C) Parameter Output High Voltage Output Low Voltage Input Leakage Current
Symbol
Condition
MSM514900 MSM514900 MSM514900 C/CSL-70 C/CSL-60 C/CSL-80 Unit Note Min. Max. VCC 0.4 10 Min. 2.4 0 -10 Max. VCC 0.4 10 Min. 2.4 0 -10 Max. VCC 0.4 10 V V mA 2.4 0 -10
VOH IOH = -5.0 mA VOL IOL = 4.2 mA 0 V VI 6.5 V; ILI All other pins not under test = 0 V DQ disable 0 V VO 5.5 V RAS, CAS cycling, tRC = Min. RAS, CAS = VIH ICC2 RAS, CAS VCC -0.2 V RAS cycling, ICC3 CAS = VIH, tRC = Min. RAS = VIH, ICC5 CAS = VIL, DQ = enable ICC6 RAS cycling, CAS before RAS RAS = VIL, ICC7 CAS cycling, tPC = Min. tRC = 125 ms, ICC10 CAS before RAS, tRAS 1 ms RAS 0.2 V, CAS 0.2 V
Output Leakage Current Average Power Supply Current (Operating) Power Supply Current (Standby) Average Power Supply Current (RAS-only Refresh) Power Supply Current (Standby) Average Power Supply Current (CAS before RAS Refresh) Average Power Supply Current (Fast Page Mode) Average Power Supply Current (Battery Backup) Average Power Supply Current (CAS before RAS Self-Refresh)
ILO
-10
10
-10
10
-10
10
mA
ICC1
-- -- -- -- --
140 2 1 200 140
-- -- -- -- --
130 2 1 200 130
-- -- -- -- --
120 2 1 200 120
mA 1, 2
mA mA
1 1, 5
mA 1, 2
--
5
--
5
--
5
mA
1
--
140
--
130
--
120
mA 1, 2
--
130
--
120
--
110
mA 1, 3
--
300
--
300
--
300
mA
1, 4, 5
ICCS
--
300
--
300
--
300
mA
1, 5
Notes:
1. 2. 3. 4. 5.
ICC Max. is specified as ICC for output open condition. The address can be changed once or less while RAS = VIL. The address can be changed once or less while CAS = VIH. VCC - 0.2 V VIH 6.5 V, -1.0 V VIL 0.2 V. SL version.
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Semiconductor AC Characteristics (1/2)
MSM514900C/CSL
(VCC = 5 V 10%, Ta = 0C to 70C) Note 1, 2, 3 Parameter Random Read or Write Cycle Time Read Modify Write Cycle Time Fast Page Mode Cycle Time Fast Page Mode Read Modify Write Cycle Time Access Time from RAS Access Time from CAS Access Time from Column Address Access Time from CAS Precharge Access Time from OE Output Low Impedance Time from CAS CAS to Data Output Buffer Turn-off Delay Time OE to Data Output Buffer Turn-off Delay Time Transition Time Refresh Period Refresh Period (SL version) RAS Precharge Time RAS Pulse Width RAS Pulse Width (Fast Page Mode) RAS Hold Time RAS Hold Time referenced to OE CAS Precharge Time (Fast Page Mode) CAS Pulse Width CAS Hold Time CAS to RAS Precharge Time RAS Hold Time from CAS Precharge RAS to CAS Delay Time RAS to Column Address Delay Time Row Address Set-up Time Row Address Hold Time Column Address Set-up Time Column Address Hold Time Column Address Hold Time from RAS Column Address to RAS Lead Time Read Command Set-up Time Read Command Hold Time Read Command Hold Time referenced to RAS
Symbol
MSM514900 MSM514900 MSM514900 C/CSL-60 C/CSL-70 C/CSL-80 Unit Note Min. Max. -- -- -- -- 60 20 30 35 20 -- 15 15 50 16 128 -- 10,000
100,000
Min. 130 185 45 100 -- -- -- -- -- 0 0 0 3 -- -- 50 70 70 20 20 10 20 70 10 40 20 15 0 10 0 15 55 35 0 0 0
Max. -- -- -- -- 70 20 35 40 20 -- 20 20 50 16 128 -- 10,000
100,000
Min. 150 205 50 105 -- -- -- -- -- 0 0 0 3 -- -- 60 80 80 20 20 10 20 80 10 45 20 15 0 10 0 15 60 40 0 0 0
Max. -- -- -- -- 80 20 40 45 20 -- 20 20 50 16 128 -- 10,000
100,000
tRC tRWC tPC tPRWC tRAC tCAC tAA tCPA tOEA tCLZ tOFF tOEZ tT tREF tREF tRP tRAS tRASP tRSH tROH tCP tCAS tCSH tCRP tRHCP tRCD tRAD tASR tRAH tASC tCAH tAR tRAL tRCS tRCH tRRH
110 155 40 85 -- -- -- -- -- 0 0 0 3 -- -- 40 60 60 15 15 10 20 60 10 35 20 15 0 10 0 15 50 30 0 0 0
ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 8 8 5 6 4, 5, 6 4, 5 4, 6 4 4 4 7 7 3 11
-- -- -- 10,000 -- -- -- 40 30 -- -- -- -- -- -- -- -- --
-- -- -- 10,000 -- -- -- 50 35 -- -- -- -- -- -- -- -- --
-- -- -- 10,000 -- -- -- 60 40 -- -- -- -- -- -- -- -- --
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Semiconductor AC Characteristics (2/2)
MSM514900C/CSL
(VCC = 5 V 10%, Ta = 0C to 70C) Note 1, 2, 3 Parameter Write Command Set-up Time Write Command Hold Time Write Command Hold Time from RAS Write Command Pulse Width OE Command Hold Time Write Command to RAS Lead Time Write Command to CAS Lead Time Data-in Set-up Time Data-in Hold Time Data-in Hold Time from RAS OE to Data-in Delay Time CAS to WE Delay Time Column Address to WE Delay Time RAS to WE Delay Time CAS Precharge WE Delay Time CAS Active Delay Time from RAS Precharge RAS to CAS Set-up Time (CAS before RAS) RAS to CAS Hold Time (CAS before RAS) RAS Pulse Width (CAS before RAS Self-Refresh) RAS Precharge Time (CAS before RAS Self-Refresh) CAS Hold Time (CAS before RAS Self-Refresh)
Symbol
MSM514900 MSM514900 MSM514900 C/CSL-60 C/CSL-70 C/CSL-80 Unit Note Min. Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Min. 0 15 55 15 20 20 20 0 15 55 20 50 65 100 70 10 10 15 100 130 -50 Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Min. 0 15 60 15 20 20 20 0 15 60 20 50 70 110 75 10 10 15 100 150 -60 Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns 11 11 11 9 9 9 9 10 10 9 0 15 50 15 15 15 15 0 15 50 15 40 60 90 65 10 10 15 100 110 -40
tWCS tWCH tWCR tWP tOEH tRWL tCWL tDS tDH tDHR tOED tCWD tAWD tRWD tCPWD tRPC tCSR tCHR tRASS tRPS tCHS
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Semiconductor Notes:
MSM514900C/CSL
1. A start-up delay of 200 s is required after power-up, followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved. 2. The AC characteristics assume tT = 5 ns. 3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals. Transition times (tT) are measured between VIH and VIL. 4. This parameter is measured with a load circuit equivalent to 2 TTL loads and 100 pF. 5. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met. tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified tRCD (Max.) limit, then the access time is controlled by tCAC. 6. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met. tRAD (Max.) is specified as a reference point only. If tRAD is greater than the specified tRAD (Max.) limit, then the access time is controlled by tAA. 7. tOFF (Max.) and tOEZ (Max.) define the time at which the output achieves the open circuit condition and are not referenced to output voltage levels. 8. tRCH or tRRH must be satisfied for a read cycle. 9. tWCS, tCWD, tRWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only. If tWCS tWCS (Min.), then the cycle is an early write cycle and the data out will remain open circuit (high impedance) throughout the entire cycle. If tCWD tCWD (Min.) , tRWD tRWD (Min.), tAWD tAWD (Min.) and tCPWD tCPWD (Min.), then the cycle is a read modify write cycle and data out will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, then the condition of the data out (at access time) is indeterminate. 10. These parameters are referenced to the CAS leading edge in an early write cycle, and to the WE leading edge in an OE control write cycle, or a read modify write cycle. 11. Only SL version.
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E2G0096-17-41I Semiconductor MSM514900C/CSL
,,, , ,,,,
TIMING WAVEFORM
Read Cycle
tRC tRAS tRP RAS VIH - VIL - tAR tCRP tCRP tCSH tRCD CAS VIH - VIL - tRAD tRSH tCAS tRAL tASR tRAH tASC tCAH Address VIH - VIL - VIH - VIL - Row Column tRCS tRRH tRCH WE tAA tROH VIH - OE VIL - VOH - tOEA tRAC tCAC tOEZ tOFF DQ VOL - Open Valid Data-out tCLZ "H" or "L"
Write Cycle (Early Write)
tRC
tRAS
tRP
RAS
VIH - VIL -
tAR
tCRP
tCRP
tCSH
tRCD
tRSH
VIH - CAS VIL - VIH - VIL - VIH - VIL -
tRAD tRAH
tCAS
tASR
tASC
tCAH
tRAL
Address
Row
Column
tWCS
tWCH tWP
tCWL
WE
tWCR
tRWL
OE
VIH - VIL -
tDS
tDHR
tDH
DQ
VIH - VIL -
Valid Data-in
Open
"H" or "L"
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,,,
Semiconductor MSM514900C/CSL Read Modify Write Cycle
tRWC tRAS tRP RAS VIH - VIL - tAR tCSH tCRP tCRP tRCD tRSH VIH - CAS VIL - tCAS tASR tRAH tASC tCAH VIH - Address VIL - WE OE VIH - VIL - VIH - VIL - VI/OH- Row Column tRAD tRWD tCWD tAA tAWD tCWL tRWL tWP tRCS tOEA tOED tOEH tCAC tRAC tOEZ tDS tDH DQ VI/OL- tCLZ Valid Data-out Valid Data-in "H" or "L"
10/16
, ,, , , ,,
Semiconductor MSM514900C/CSL Fast Page Mode Read Cycle
tRASP tRP VIH - RAS V - IL VIH - CAS VIL - VIH - VIL - VIH - VIL - tAR tRHCP tCRP tRCD tPC tRSH tCRP tCP tCP tRAD tCAS tCAS tCAS tASR tRAH tASC tCSH tCAH tASC tCAH tASC tRAL tCAH Address Row Column Column Column tRCS tRCH tRCS tAA tRCH tRCS tAA tRCH WE tAA tRRH VIH - OE VIL - tOEA tCPA tCPA tOEA tOEA tCAC tRAC tOFF tOEZ tCAC tOFF tCAC tOFF tCLZ tOEZ tCLZ tOEZ VOH - DQ VOL - tCLZ
Valid Data-out Valid Data-out Valid Data-out
"H" or "L"
Fast Page Mode Write Cycle (Early Write)
tRASP tPC
tRP
VIH - RAS V - IL VIH - CAS VIL - VIH - VIL -
tAR
tRHCP
tCRP
tRCD
tRSH
tCRP
tCAS
tCP
tCP
tCAS
tCAS
tASR
tRAH tASC tRAD
tCSH tCAH
tASC
tCAH
tASC
tCAH
tRAL
Address
Row
tWCS
VIH - WE VIL -
Column tCWL tWCH tWP tWCR tDH
Column tCWL tWCS tWCH tWP
Column tRWL tCWL tWCS tWCH tWP tDS tDH
tDS
tDS
tDH
DQ
VIH - VIL -
Valid Data-in
Valid Data-in
Valid Data-in
tDHR
Note: OE = "H" or "L"
"H" or "L"
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Semiconductor
MSM514900C/CSL
RAS
VIH - VIL -
CAS
VIH - VIL -
Address
VIH - VIL -
,
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,, ,,,
Semiconductor MSM514900C/CSL CAS before RAS Refresh Cycle
tRC tRP tRAS tRP RAS VIH - VIL - tRPC tRPC tCP tCSR tCHR CAS VIH - VIL - VOH - VOL - tOFF DQ Open Note: WE, OE, Address = "H" or "L" "H" or "L"
Hidden Refresh Read Cycle
tRC
tRC
tRAS
tRP
tRAS
tRP
RAS
VIH - VIL - VIH - VIL -
tAR
tCRP
tRCD
tRSH
tCHR
CAS
tASR
tRAD tASC tRAH
tCAH
Address
VIH - VIL -
Row
Column
tRCS
tRAL
tRRH
VIH - WE V IL - VIH - OE V IL -
tAA
tROH
tOEA
tRAC DQ VOH - VOL -
tCAC tCLZ Valid Data-out
tOFF tOEZ
"H" or "L"
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,,, ,
Hidden Refresh Write Cycle
tRC tRAS tRP tRC tRAS tRP VIH - RAS VIL - CAS VIH - VIL - tAR tCRP tRCD tRSH tCHR tASR tRAH tRAD tASC tCAH tRAL Address VIH - VIL - V WE IH - VIL - VIH - OE VIL - Row tWCS Column tRWL tWCH tWP tWCR tDS tDH DQ VIH - VIL - Valid Data-in tDHR "H" or "L"
Semiconductor
MSM514900C/CSL
CAS before RAS Self-Refresh Cycle
tRP
tRASS
tRPS
RAS
VIH - VIL -
tRPC
tCP
tCSR
tRPC
tCHS
CAS
VIH - VIL -
tOFF
DQ VOH - VOL -
Open
Note: WE, OE, Address = "H" or "L" Only SL version
"H" or "L"
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Semiconductor
MSM514900C/CSL
PACKAGE DIMENSIONS
(Unit : mm)
SOJ28-P-400-1.27
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM514900C/CSL
(Unit : mm)
TSOPII28-P-400-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.51 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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